A Model Stencil : CPU IC / Nand Flash IC
B Model Stencil : Baseband IC / WiFi IC
C Model Stencil : Radio Frequency IC / Power Amplifier IC / Small IC
D Model Stencil : Screen IC / Face ID Module / Charging Port Flex Cable / Proximity Sensor
/ True Tone Sensor / Camera Module
The 2UUL BG01 ABCD BGA Reballing Stencil Kit is a premium, all-in-one toolkit specifically designed for professional iPhone motherboard repair and IC reballing. Compatible with iPhone 8, 8 Plus, X, and 16 Pro/Max, this kit provides precise tools for CPU, NAND, Face ID, camera, hard disk, and IC module repair, ensuring professional-grade results for complex chip-level repairs.
Whether you’re a mobile repair technician, electronics engineer, or advanced DIY enthusiast, the 2UUL BG01 kit offers accuracy, durability, and efficiency needed to restore iPhone devices to perfect working condition.
Comprehensive ABCD Stencil Kit for iPhone Repairs
The kit features ABCD BGA stencils carefully engineered to cover critical iPhone components, including:
CPU and GPU reballing
NAND and memory IC repair
Face ID module and camera IC rework
Hard disk and logic IC soldering
Each stencil is laser-cut with micro-precision holes to ensure perfect solder ball alignment, consistent reflow, and professional-quality repairs.
Premium Stainless Steel Construction
Each stencil in the 2UUL BG01 kit is crafted from high-grade stainless steel, offering durability, heat resistance, and corrosion protection. The key material features include:
0.12mm–0.15mm ultra-thin profile for optimal heat transfer
Laser-etched micro-holes for precise solder ball placement
Smooth anti-stick surface to prevent solder residue accumulation
Warp- and corrosion-resistant design for repeated use
This construction ensures the stencil maintains flatness and accuracy during multiple reflow cycles, making it suitable for high-volume professional repair environments.
Optimized for iPhone CPU and IC Rework
The 2UUL BG01 stencil kit is designed for precision alignment and soldering on iPhone motherboards. It is perfect for:
BGA reballing on iPhone CPUs and GPUs
NAND flash and memory IC chip repair
Face ID, camera module, and sensor IC repairs
Hard disk and logic IC maintenance
With precise hole alignment and superior heat conduction, the kit ensures clean soldering results, reducing the risk of bridging, misalignment, or solder joint failure.
Easy-to-Use and Efficient
The 2UUL BG01 kit is compatible with both manual and automated reballing setups. Simply:
Align the stencil over the chip
Apply solder paste or preformed solder balls
Heat evenly with a reflow or hot air station
The anti-stick surface ensures easy solder ball release, while the stainless steel construction allows multiple reuse cycles without affecting performance. This kit significantly reduces repair time and improves success rates, making it ideal for professional service centers.
Why Choose the 2UUL BG01 ABCD Kit
Complete ABCD stencils for full iPhone repair coverage
Laser-cut precision holes for accurate solder alignment
Durable stainless steel construction for long-term use
Ultra-thin design (0.12–0.15mm) for efficient heat transfer
Compatible with iPhone 8, 8 Plus, X, 16 Pro, and Max
Reusable, easy to clean, and reliable
Professional-grade solution for repair shops and technicians
Applications
iPhone CPU, GPU, and NAND IC reballing
Face ID, camera, and sensor IC module repair
Hard disk and memory IC soldering
Professional BGA micro-soldering and rework
Electronics repair workshops and training labs
Professional iPhone Repair Made Easy
The 2UUL BG01 ABCD BGA Reballing Stencil Kit provides precision, durability, and efficiency required by professional iPhone repair technicians. With laser-cut stencils, premium stainless steel construction, and reusable design, it ensures accurate solder ball placement and flawless reflow every time.
For high-quality motherboard, CPU, NAND, Face ID, camera, and hard disk IC repairs, the 2UUL BG01 kit is the ultimate tool trusted by repair professionals worldwide.
