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Amaoe F707-012 Middle Layer BGA Reballing Stencil for Samsung Galaxy Z Flip 5G

  • Model: Amaoe F707-012 Middle Layer BGA Reballing Stencil
  • Compatibility: Samsung Galaxy Z Flip 5G (F707-012) logic board
  • Material: High-quality stainless steel
  • Application: BGA chip reballing, solder paste application, IC reinstallation
  • Manufacturing Technique: Precision laser-cut apertures
  • Properties: Heat-resistant, corrosion-proof, anti-bend design
  • Durability: Long-lasting and reusable
  • Performance: Perfect alignment and even solder distribution
139.00₹300.00₹
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  • Estimated Delivery 5 To 7 Working Days
Amaoe F707-012 Middle Layer BGA Reballing Stencil for Samsung Galaxy Z Flip 5G

Amaoe F707-012 Middle Layer BGA Reballing Stencil for Samsung Galaxy Z Flip 5G

139.00₹300.00₹
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