Description
HW16 BGA Reballing Stencil
The Amaoe HW16 BGA Reballing Stencil 2 is a high-precision, professional-grade stencil designed for IC-level reballing, soldering, and repair of Apple HW16 series chips found on iPhone logic boards. Part of Amaoe?s U-Series of advanced reballing tools, this stencil offers exceptional precision, heat resistance, and durability, making it an indispensable tool for professional mobile repair technicians and microsoldering engineers.
Utilizing laser micro-cutting technology, the HW16 stencil ensures perfect solder ball placement and even heat distribution, minimizing bridging and alignment errors during reballing. Its stainless steel construction provides stability under high heat, corrosion resistance, and long-term reuse, delivering consistent, professional results for CPU, NAND, PMIC, or communication chip rework.
?? Key Features
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Model: Amaoe HW16 BGA Reballing Stencil 2
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Brand: Amaoe
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Compatibility: Apple HW16 IC chips (commonly used in iPhone 12/13/14 series logic boards)
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Material: Premium stainless steel
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Thickness: 0.12mm
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Hole Precision: ?0.01mm laser-cut accuracy
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Stencil Type: Direct heat / flat-type stencil
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Surface Treatment: Anti-oxidation coating to prevent rust and wear
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Heat Resistance: Up to 500?C
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Use Case: IC chip reballing, solder paste printing, and CPU/NAND/PMIC repair
