Description
Amaoe IPBB2 BGA Reballing Stencil
The Amaoe U-IPBB2 BGA Reballing Stencil 2 is a high-precision, professional-grade stencil engineered for IC-level reballing, soldering, and repair of Apple IPBB2 series chips commonly found on iPhone logic boards. Part of Amaoe?s advanced U-Series lineup, this stencil combines accuracy, durability, and heat resistance, making it a must-have tool for professional mobile repair technicians and microsoldering engineers.
Crafted with laser micro-cutting technology, the U-IPBB2 ensures perfect solder ball alignment, uniform heat distribution, and reduced bridging risk during reballing. The stainless steel construction provides stability under high temperatures, corrosion resistance, and long-term reuse, delivering consistent, professional results for CPU, NAND, PMIC, or communication chip rework.
?? Key Features
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Model: Amaoe U-IPBB2 BGA Reballing Stencil 2
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Brand: Amaoe
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Compatibility: Apple IPBB2 IC chips (used in iPhone 13, 14, and 15 series logic boards)
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Material: High-quality stainless steel
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Thickness: 0.12mm
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Hole Precision: ?0.01mm laser-cut accuracy
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Stencil Type: Direct heat / flat stencil
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Surface Treatment: Anti-oxidation coating to prevent corrosion and wear
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Heat Resistance: Up to 500?C
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Use Case: Reballing, IC chip repair, solder paste printing, and CPU/NAND/PMIC rework
Laser-Cut Precision: Perfect solder ball alignment for consistent reballing.
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Anti-Warp Design: Maintains shape under high heat up to 500?C.
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Durable Construction: Stainless steel ensures long-term usability and stability.
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Professional-Grade Performance: Designed for certified technicians and repair labs.
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Smooth Cleaning Surface: Easy to clean with isopropyl alcohol and lint-free cloths.
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Reusable Design: Supports multiple reballing cycles without loss of accuracy.
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Lead-Free Compatible: Works with both leaded and lead-free solder materials.
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Anti-Oxidation Finish: Protects against rust and extends service life.
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Consistent Heat Distribution: Ensures even solder reflow during BGA reballing.
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Optimized for IC Repair: Perfect for CPU, NAND, PMIC, and baseband chips.
