Description
Amaoe iQ11P-012 BGA Reballing Stencil For iQoo 11Pro
Amaoe iQ11P-012 BGA Reballing Stencil for iQOO 11 Pro – Precision You Can Trust
Unlock flawless reballing performance with the Amaoe iQ11P-012 BGA Reballing Stencil for iQOO 11 Pro – the ultimate tool designed for mobile technicians and professional repair engineers. This premium-quality stencil delivers unmatched precision, ensuring every solder ball lands exactly where it should.
🔧 Designed for Precision Work
The Amaoe iQ11P-012 BGA Reballing Stencil for iQOO 11 Pro is engineered specifically for the iQOO 11 Pro layout. Its micro-etched aperture design guarantees perfect alignment with solder pads, allowing precise application of solder paste or solder balls during BGA chip reballing.
🛠 Built to Last
Crafted from high-grade stainless steel, this stencil resists heat warping and delivers durability for repeated use. Whether you’re handling complex chip-level repairs or daily PCB maintenance, this stencil stands up to the challenge, making it an essential tool in any repair kit.
💡 Easy to Use
Place the stencil directly over the BGA chip or PCB, apply solder paste or balls, and use a hot air station or reflow system to fix the solder accurately. Its fine-cut design ensures clean application and minimal mess.
✅ Why Choose Amaoe?
-
Accurate and device-specific fit
-
Strong and heat-resistant build
-
Ideal for reballing, IC replacement, and micro-soldering
-
Trusted by top-level mobile repair professionals
📦 Perfect for Repair Shops and DIY Experts
Whether you’re running a high-volume service center or repairing your own devices, the Amaoe iQ11P-012 BGA Reballing Stencil for iQOO 11 Pro gives you the confidence to work cleanly, quickly, and correctly.
Boost your repair success rate – Choose precision. Choose quality. Choose Amaoe.
