Description
Amaoe S908-012 Middle Layer BGA Reballing Stencil For Samsung S22 Ultra
Amaoe S908-012 Middle Layer BGA Reballing Stencil For S22 Ultra
Take your mobile repair precision to the next level with the Amaoe S908-012 Middle Layer BGA Reballing Stencil For S22 Ultra. This high-quality stencil is expertly engineered for professional technicians who need consistent, accurate results during reballing and soldering tasks.
Precision You Can Trust
Crafted specifically for the Samsung S22 Ultra, this stencil ensures perfect alignment with the BGA chip layout, making it easy to reball or rework IC components without risking misalignment or excess solder. It’s your go-to solution for restoring motherboard functionality with factory-like finish.
Durable Build for Repeated Use
Made from premium-grade stainless steel, the Amaoe S908-012 is heat-resistant, corrosion-proof, and built to last through multiple soldering cycles. Its ultra-fine aperture design allows precise application of solder paste or solder balls, giving you complete control over the reballing process.
Easy to Use – Professional Results
To use, simply align the stencil over the PCB or BGA chip, apply solder paste or solder balls, and heat with a rework station. Whether you’re handling rework, chip replacement, or logic board repairs, this stencil ensures a clean and secure bond every time.
Why Choose Amaoe S908-012 Stencil?
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Perfect Fit for S22 Ultra motherboard and chip layout
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Time-saving during reballing, thanks to accurate aperture alignment
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Superior quality ensures reliability, even with repeated use
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Trusted by professionals across the mobile repair industry
If you’re looking for a reliable tool for high-end repairs, the Amaoe S908-012 Middle Layer BGA Reballing Stencil For S22 Ultra is the smart choice. Precision, performance, and durability—everything a technician needs in one essential tool.
Compatible Models :-
- Samsung S22 Ultra
- SM-908U
- SM-S908B
