Description
Amaoe SAM 15 Bga Stencil
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- This BGA Reballing stencil for is made of High Quality Steel. Strong Magnetic Attraction and Precision Positioning.
- The Tin Planting Net can be heated by the hot air machine, these stencils are not easy to deform when heated.
- This BGA Reballing Stencil Template is mainly used for Samsung S8 / S8+/ NOTE8 BGA Stencil IC CPU Reballing, Such as Exynos8895, MSM8998 etc.
- APPLICATION: Amaoe SAM:15 BGA Reballing Stencil Template for Samsung S21, Tin Planting Net/Heating Direct Steel Mesh for Ultra/G998U G996U/Z Flip 3/W22 SM8350 Exyn2100 CPU RAM IC Chip PM8350 BGA153
