Description
AMAOE PM3 Stencil Power IC
Amaoe PM-3 Stencil for Qualcomm PM Power IC – Precision Reballing Made Easy
The Amaoe PM-3 Stencil for Qualcomm PM Power ICs is a professional-grade tool crafted for precision and reliability in micro-soldering and reballing tasks. Whether you’re repairing power ICs or replacing BGA components, this stencil ensures flawless solder paste application, reducing errors and enhancing work efficiency.
Why to Buy:
The Amaoe PM-3 Stencil for Qualcomm PM Power is a must-have for mobile repair engineers, especially when working on Qualcomm Power ICs. Designed specifically for supported PM models like PM7150, PM660A, PM670L, PM8150A, and more, this stencil aligns perfectly with each pad, guaranteeing high accuracy during solder paste application or solder ball placement.
Quality & Durability:
Made from premium stainless steel, the stencil withstands high temperatures and rigorous reballing cycles without warping or losing shape. The precision-cut apertures ensure consistent solder flow, making your repairs cleaner and more professional.
Assurity & Trust Factor:
Amaoe is a trusted brand among professional technicians for high-quality tools. This stencil is a reliable companion in your mobile repairing toolkit, offering consistency and durability. Whether you run a repair business or work independently, this stencil brings confidence to your repairs.
Benefits:
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Accurate solder paste deposition
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Compatible with over 20 Qualcomm PM models
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Durable, reusable material
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Reduces time and rework in reballing
How to Use:
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Align the stencil with the IC or PCB pads.
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Apply solder paste or place solder balls over the apertures.
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Gently lift the stencil to reveal perfectly placed solder.
When precision matters, choose the Amaoe PM-3 Stencil for Qualcomm PM Power to make every reballing job smooth, fast, and flawless. An essential tool for every mobile repair expert.
