Description
Amaoe U-E9925 BGA Reballing Stencil
The Amaoe U-E9925 BGA Reballing Stencil 3 is a professional-grade, ultra-precise laser-cut stencil designed for reballing and soldering Apple E9925 IC chips. This model is part of Amaoe?s advanced ?U-Series? reballing stencils, trusted globally by logic board repair experts and microsoldering professionals for its precision, heat stability, and reusability.
Crafted using high-quality stainless steel and CNC laser-cutting technology, the U-E9925 stencil ensures perfect solder ball placement and uniform heat transfer ? crucial for reballing delicate IC chips used in iPhone logic boards. Whether you’re reworking CPU, NAND, PMIC, or communication chips, this stencil offers industrial-grade performance and unmatched reliability.
?? Key Features
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Model: Amaoe U-E9925 BGA Reballing Stencil 3
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Brand: Amaoe
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Compatibility: Designed specifically for Apple E9925 IC chips (commonly used in iPhone 14 / 15 series logic boards)
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Material: Premium stainless steel with corrosion-resistant coating
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Thickness: 0.12mm (optimal for fine solder ball alignment)
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Type: Direct heating / flat stencil
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Manufacturing Process: Precision laser cutting with ?0.01mm tolerance
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Heat Resistance: Up to 500?C (anti-warp, anti-deformation)
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Surface Finish: Anti-oxidation treated for long-term durability
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Use Case: CPU, NAND, PMIC, or baseband chip reballing and IC-level repair
?? Technical Specifications
| Specification | Details |
|---|---|
| Product Name | Amaoe U-E9925 BGA Reballing Stencil 3 |
| Model Code | U-E9925 |
| Material | Stainless Steel |
| Thickness | 0.12mm |
| Precision | ?0.01mm |
| Heat Resistance | 500?C Max |
| Surface Treatment | Anti-oxidation Coating |
| Type | Flat / Direct Heat |
| Application | IC Chip Reballing, Logic Board Repair |
| Compatibility | Apple E9925 (iPhone 14/15 logic boards) |
| Made In | india |
| ? | ? |
?Product Highlights
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Ultra-Fine Precision: Laser-cut holes ensure even solder ball placement and perfect reballing alignment.
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Durable Construction: Made of stainless steel for longevity and resistance to deformation under high heat.
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Anti-Warp Design: Maintains flatness even under 500?C direct heating.
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Professional Rework Support: Optimized for use in BGA chip repair and IC replacement tasks.
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Easy Cleaning: Smooth surface resists oxidation and allows quick cleaning with isopropyl alcohol.
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Reusable Design: Built to withstand repeated heating and cleaning cycles without losing precision.
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Compatible with Multiple IC Types: Works with CPU, NAND, PMIC, and baseband chips that use the E9925 platform.
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Excellent Heat Transfer: Ensures even solder reflow for consistent reballing results.
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Trusted Brand: Amaoe is a recognized leader in reballing and IC repair equipment.
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Professional-Grade Finish: Anti-corrosion coating extends service life in demanding repair environments.




