Description
Amaoe U-IP9 STENCIL IP13-A15
Amaoe U-IP9 IP13-A15 Stencil for iPhone 13/Pro/Max/Mini – Precision Reballing Made Easy
Looking for a professional-grade Amaoe U-IP9 IP13-A15 stencil that delivers flawless results? This stencil is designed specifically for reballing and soldering tasks on iPhone 13, 13 Pro, 13 Pro Max, and 13 Mini logic boards, ensuring high accuracy and consistent performance.
Built with premium stainless steel, the Amaoe U-IP9 IP13-A15 stencil offers exceptional durability, making it ideal for repeated high-temperature use. Whether you’re applying solder paste or reballing BGA chips, the micro-precision apertures align perfectly with the device’s solder pads for accurate and efficient work.
Why choose this stencil?
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Top-tier Quality: Manufactured with high-grade stainless steel for longevity and precision.
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Assured Compatibility: Tailored specifically for iPhone 13 series devices.
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Trust Factor: Amaoe is a trusted name in professional mobile repair tools.
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Effortless Usage: Simply align the stencil over the chip, apply solder paste or balls, and heat – the perfect solder every time.
How to use:
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Place the Amaoe U-IP9 IP13-A15 stencil over the targeted IC or PCB.
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Apply solder paste or solder balls using a spreader or hot air gun.
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Remove the stencil gently.
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Reflow with hot air for a perfect bond.
Benefits:
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Reduces chances of misalignment
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Speeds up the repair workflow
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Professional finish every time
Ideal for both beginners and advanced technicians, the Amaoe U-IP9 IP13-A15 stencil is a must-have for anyone serious about mobile repair. Trust in precision. Trust in quality. Trust Amaoe.