Description
Amtech RMA-223 Solder Flux Paste 10cc is a high-quality no-clean soldering flux designed for mobile phone repair, PCB rework, BGA reballing, and electronic component soldering. Its high-viscosity formula provides excellent solder wetting, smooth solder flow, and reliable soldering performance.
This Amtech RMA-223 Flux Paste helps reduce oxidation during soldering and supports clean, precise solder joints. It is ideal for mobile IC repair, laptop motherboard repair, BGA/PGA chip rework, and fine-pitch electronic soldering using soldering irons or hot air rework stations.
The RMA-223 No-Clean Flux Paste comes in a convenient 10cc syringe for controlled and accurate application. It leaves relatively low, often transparent residue, reducing cleaning requirements for suitable applications. Its smooth consistency makes it useful for professional mobile repair technicians, electronics engineers, and PCB repair work.
Key Features
- ✅ High-Quality Soldering Flux: Suitable for professional PCB and electronic repairs.
- ✅ No-Clean Formula: Helps reduce post-solder cleaning requirements.
- ✅ Excellent Wetting: Improves solder flow and joint formation.
- ✅ High Viscosity: Provides controlled application without excessive spreading.
- ✅ Oxidation Protection: Helps reduce oxidation during soldering.
- ✅ Low Residue: Designed to leave minimal, often transparent flux residue.
- ✅ BGA & PGA Compatible: Suitable for IC reballing and chip-level soldering.
- ✅ Precision Application: Convenient 10cc syringe for accurate dispensing.
- ✅ Versatile Applications: Ideal for mobile repair, motherboard rework, and electronics soldering.
Product Specifications
| Specification | Details |
|---|---|
| Brand | Amtech |
| Model Number | RMA-223 |
| Product Name | Amtech RMA-223 Solder Flux Paste |
| Product Type | No-Clean Soldering Flux |
| Color | Yellow |
| Quantity | 10cc / 10ml |
| Packaging Type | Syringe |
| Flux Consistency | High Viscosity Paste |
| Flux Type | RMA (Rosin Mildly Activated) |
| Residue | Low / Transparent Residue |
| Cleaning Requirement | Generally No-Clean; Application Dependent |
| Application | PCB Soldering, BGA Reballing & IC Rework |
| Suitable For | Mobile Phones, Laptops, PCBs & Electronic Components |
| Compatible Tools | Soldering Iron & Hot Air Rework Station |
| Needle Tip | Not Included |


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