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Amtech RMA-223 Flux Paste 10cc

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Amtech Flux Paste RMA-223 10cc

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Description

Amtech RMA-223 Solder Flux Paste 10cc is a high-quality no-clean soldering flux designed for mobile phone repair, PCB rework, BGA reballing, and electronic component soldering. Its high-viscosity formula provides excellent solder wetting, smooth solder flow, and reliable soldering performance.

This Amtech RMA-223 Flux Paste helps reduce oxidation during soldering and supports clean, precise solder joints. It is ideal for mobile IC repair, laptop motherboard repair, BGA/PGA chip rework, and fine-pitch electronic soldering using soldering irons or hot air rework stations.

The RMA-223 No-Clean Flux Paste comes in a convenient 10cc syringe for controlled and accurate application. It leaves relatively low, often transparent residue, reducing cleaning requirements for suitable applications. Its smooth consistency makes it useful for professional mobile repair technicians, electronics engineers, and PCB repair work.

Key Features

  • ✅ High-Quality Soldering Flux: Suitable for professional PCB and electronic repairs.
  • ✅ No-Clean Formula: Helps reduce post-solder cleaning requirements.
  • ✅ Excellent Wetting: Improves solder flow and joint formation.
  • ✅ High Viscosity: Provides controlled application without excessive spreading.
  • ✅ Oxidation Protection: Helps reduce oxidation during soldering.
  • ✅ Low Residue: Designed to leave minimal, often transparent flux residue.
  • ✅ BGA & PGA Compatible: Suitable for IC reballing and chip-level soldering.
  • ✅ Precision Application: Convenient 10cc syringe for accurate dispensing.
  • ✅ Versatile Applications: Ideal for mobile repair, motherboard rework, and electronics soldering.

Product Specifications

Specification Details
Brand Amtech
Model Number RMA-223
Product Name Amtech RMA-223 Solder Flux Paste
Product Type No-Clean Soldering Flux
Color Yellow
Quantity 10cc / 10ml
Packaging Type Syringe
Flux Consistency High Viscosity Paste
Flux Type RMA (Rosin Mildly Activated)
Residue Low / Transparent Residue
Cleaning Requirement Generally No-Clean; Application Dependent
Application PCB Soldering, BGA Reballing & IC Rework
Suitable For Mobile Phones, Laptops, PCBs & Electronic Components
Compatible Tools Soldering Iron & Hot Air Rework Station
Needle Tip Not Included

Additional information

Weight 0.050 kg
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