Description
BGA Chip Remove Special Blade Hong Hai Tong B8
High-quality BABA TOOLS blade with handle set for mobile phone motherboard CPU IC repair. Professional Phone Motherboard CPU IC glue removal blade set. Special steel shovel knife blade, used to disassemble layered chips and remove glue
Features:
1# blade: mainly used to disassemble the small chip or remove the glue of the small chip.
2# blade: mainly used to disassemble large chips or remove the glue of large chips.
3# blade: mainly used for the disassembly and glue removal of double-layer or single-layer CPU chips.
4# blade: specially designed for Android fonts, and can also be used to disassemble other chips.
5# blade: used for chip hooking and scraping glue, suitable for small gaps and corners.
6# blade: mainly used to disassemble the Nand flash, baseband, WIFI IC.
Blade handle: imported material, high temperature resistance, no heat conduction, anti-static, light and flexible, easy to use.
