BGA Paste Mechanic MS38

The Mechanic MS38 BGA Solder Paste Sn42/Bi58 (138°C) 50g is a premium, low-temperature solder paste specially formulated for delicate electronics and reballing applications. Exclusively available from BABA TOOLS, this high-performance soldering compound is engineered to deliver superior consistency, strong wetting, and smooth solder joints for precise mobile and PCB repair.

Whether you are a mobile repair technician, PCB assembly expert, or reballing specialist, the Mechanic MS38 Solder Paste ensures stable, clean, and reliable results with every use. At babaocamachine.com, we supply only original Mechanic products that meet professional-grade standards for durability and performance.

1. Overview

The Mechanic MS38 BGA Paste is a lead-free, low-melting-point solder paste designed for modern electronic repair and assembly. Its Sn42/Bi58 alloy composition melts at just 138°C, making it ideal for temperature-sensitive devices such as smartphones, tablets, and fine-pitch BGA components.

Manufactured using advanced flux chemistry and micro-sized solder powder, the Mechanic MS38 paste ensures excellent printability, minimal residue, and strong electrical connections. Trusted by technicians worldwide, it’s the go-to solder paste for reballing, chip replacement, and micro-soldering tasks.

2. Key Features

✔ Low Melting Point (138°C)

The Sn42/Bi58 composition melts quickly at 138°C, reducing thermal stress on sensitive chips and circuit boards. This makes it perfect for BGA rework and components that cannot tolerate high soldering temperatures.

✔ Smooth Printing and Easy Application

Mechanic MS38 offers outstanding stencil performance. Its fine particle size and optimized viscosity allow for smooth and precise dispensing during manual or automated soldering.

✔ Strong Adhesion and Reliable Bond

Once reflowed, the solder forms robust joints with excellent mechanical and electrical strength, ensuring long-term reliability for repaired or newly assembled circuits.

✔ Minimal Residue and Oxidation

Thanks to its high-purity flux and oxidation-resistant alloy powder, this solder paste leaves minimal residue, reducing cleanup time and improving the visual quality of finished joints.

✔ Ideal for BGA, SMD, and Microchip Rework

Mechanic MS38 is specially developed for precision rework involving Ball Grid Arrays (BGA), Surface Mount Devices (SMD), and micro components, allowing technicians to achieve factory-quality connections even under a microscope.

✔ Excellent Wetting and Reflow Characteristics

The paste flows smoothly during reflow, creating uniform joints that enhance electrical conductivity and minimize the risk of bridging or voids.