Description
The KMQE10013M-B318 IC is an eMCP memory chip designed for use in compatible mobile phones and other electronic devices. It combines eMMC storage and LPDDR3 memory in a single package, helping reduce the amount of motherboard space required for separate storage and RAM components.
This IC provides 16GB eMMC storage with 2GB LPDDR3 RAM and uses a 221-ball BGA package. It is suitable for professional motherboard-level repair where the original compatible memory IC has become damaged, faulty, or requires replacement.
The KMQE10013M-B318 is intended for technicians experienced in BGA IC removal, reballing, soldering, programming, and motherboard repair. The exact part number and board compatibility should always be confirmed before installation because ICs with similar specifications may still have different pin layouts or firmware requirements.
Key Features
- KMQE10013M-B318 eMCP memory IC
- Combines storage and RAM in one package
- 16GB eMMC storage capacity
- 2GB LPDDR3 mobile memory
- 221-ball BGA package
- Suitable for compatible mobile motherboard repair
- Useful for damaged memory IC replacement
- Designed for professional board-level repair work
- Requires BGA soldering and repair experience
Specifications
| Specification | Details |
|---|---|
| Part Number | KMQE10013M-B318 |
| Manufacturer | Samsung |
| IC Type | eMCP Memory IC |
| Storage Capacity | 16GB |
| Storage Technology | eMMC |
| RAM Capacity | 2GB |
| RAM Technology | LPDDR3 |
| Package Type | 221-Ball BGA |
| Maximum Data Transfer Rate | Up to 200 MB/s |
| Mounting Type | Surface Mount |
| Application | Compatible Mobile Phone & Motherboard Repair |
| Installation | Professional BGA Installation Required |
