Luowei HS3 Preheat Platform For Phone PCB Layering IC Glue Remover Preheater

Luowei HS3 Uniform Preheat Platform Phone Motherboard CPU IC Heating Plate for mobile phone PCB board layering laminating chip glue removal, etc. Luowei HS3 99W constant temperature control preheating platform 65mm*100mm heating size suitable for various mobile phone motherboards tinning, degumming, and laminating, etc.

Product Features :-

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• Material construction: Made of aviation aluminum alloy, it not only improves durability but also ensures efficient heating coverage.
• Three-level insulation design: helps maintain optimal temperature while minimizing heat loss, better improving energy efficiency and effective performance during maintenance.
• Uniform heating: Providing consistent heat distribution is essential to prevent damage to sensitive components during maintenance.
• Wide range of uses: Suitable for tasks such as motherboard layering, lamination, tinning, degumming, temperature control, etc.
• Portable and efficient: Small size and easy to carry, strong performance and precise temperature control.
• Simple operation: Can reflect the status of the device according to color changes.
• Rapid heating: Maximum power 99W, no need for hot air gun soldering iron, heating evenly.