MECHANIC 002 Glue Remover Blades – Professional BGA IC Chip Degumming & Motherboard Repair Tool
Upgrade your repair workflow with the MECHANIC 002 Blades Glue Remover BGA IC Chip Degumming Scraping Knife, a precision-crafted toolkit designed for smartphone, motherboard, BGA IC chip, CPU, and chip layer disassembly. Engineered for technicians who demand accuracy and durability, this multifunctional repair blade set delivers superior performance for glue removal, chip degumming, scraping, tapping, shoveling, and delicate motherboard maintenance.
Premium Quality & Trusted Performance
Made from high-strength materials and polished to a fine edge, the MECHANIC 002 blades offer exceptional control and stability. The compact 45×18mm and 30×15mm blade sizes make it easy to maneuver through tight spaces on iPhone, Android, and laptop circuit boards. Lightweight yet durable, the blades feature a 10g net weight, ensuring comfortable long-term use without hand fatigue.
For technicians who value craftsmanship, this set also includes Qianli DP-007 / DP-008 handmade polished glue remover knife blades, known for their sharpness, reliability, and professional finish.
Why Choose This Kit?
- Multi-functional: Perfect for BGA chip repair, CPU layering, glue cutting, and motherboard disassembly
- Precision Handling: Sharp edges for clean, efficient scraping
- High Trust Factor: Used by professional repair shops worldwide
- Long-Lasting Material: Designed to resist wear, bending, and chipping
How to Use
Gently apply the blade to the glue or chip layer, using slow, controlled motions to lift adhesive without damaging surrounding components. Use the included abrasive paper to keep the blade sharp and ready for precision work.
Package Includes
- 2× MECHANIC 002 Glue Remover Blades
- 2× Abrasive Papers
