Mechanic Intelligent iT3 Pro Preheating Platform For iPhone X-16PM Motherboard Layered/IC Chip BGA Stencil/Dot Matrix Repair Tools

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25 in stock

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Description

Layering, tin planting, bonding, desoldering, and glue removal are integrated, and it is equipped with controllable temperature / module expansion design / no air gun and no soldering iron I plug and play technology
Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points
No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
Modular design, multiple combination modules, good scalability, easy to expand new modules
Plug and play technology, the device supports hot swap, making your work more efficient
Scope of application: latest support for IP X/XS/XS Max 11/11 Pro/11 Pro Max 12 mini/12/12 Pro/12 Pro Max 13/13mini/13 Pro/13Pro 14/14mini/14 Pro/14Pro Max 15/15Plus/15Pro/15Pro Max 16/16Plus/16Pro/16Pro Max motherboard layering. Fitting. Dot matrix repair

Weight	0.25 kg

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