Description
MECHANIC IPX 3D BGA Reballing Stencil Kit for iPhone X
- S30-TO.12mm planting tin black stencils with imported material
- The new definition of the new 3D black stencil applies the latest high precision special surface black coating process with the function of anti-oxidation, anti-corrosion, anti-damage, high oleophobic, which makes stencil more durable.
- High grade material makes high temperature resistance of 500 degrees, no bulge, no deformation, laser cutting mesh, quadrangle hole design and embedded 3d groove technology.
- There is reasonable integrated chip mesh layout, and quadrangle roundness precise hole location
- The side is pressed for tweezers to prevent the chip from shifting during tin planting process
