No air gun and no soldering iron, just plug and use
Multiple combination modules, good scalability, easy to expand new modules.
Host size: 12*14cm
Voltage 110V/220V
Layering, tin planting, bonding, desoldering, and glue removal is integrated, and it is equipped with controllable temperature/module expansion design / no air gun and no soldering iron I plug and play technology
Intelligent adjustable temperature, custom debugging temperature, debugging temperature according to different melting points
No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
Modular design, multiple combination modules, good scalability, easy to expand new modules
Plug and play technology, the device supports hot-swap, making your work more efficient
Suitable for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini/13/13 Mini/13 Pro/13 Pro Max
include in Package :-
iT3 Pro host + X-13 Pro Max mold with stencil(11pcs) + universal mold + dot matrix CPU mold
