Description
Mechanic P23 10CC Chip Rework Flux Paste For Mobile Phone Motherboard Middle Frame IC Chip Rewelding Special Soldering Oil
Product Features :-
- P23 chip rework special solder oil, specially developed for cell phone motherboard chip and mid-layer rework.
- Chip rework special flux paste, lead-free environmental protection / non-resistance / anti-oxidation / no cleaning / very strong solderability / excellent wettability.
- Specially developed for cell phone motherboard chip and mid-layer rework using high activity, low halogen lead-free material, moderate fluidity.
- High-temperature heating, good material wettability, perfect for chip desoldering, completely non-destructive, no damage to the motherboard and chip.
- Specially developed for high-end models of motherboard chip substrate, with the soldering iron and soldering tape rework cleaning pad/drag tin.
- High-temperature heating for pad residue gel removal, better rework effect, no residue.
- Ergonomic design, tailor-made, comfortable to help push, convenient and labor-saving.
- Chip back to solder with obvious effect, can enhance the chip pins and the pad back to the adhesion of the solder.
- Realize the chip back to the solder automatically cut back to the right, especially for the chip BGA back to the solder back to the effect is more significant.
