Description
Mechanic XGZ40 Flux Paste, also known as Mechanic XGZ40 Solder Paste, is a high-quality soldering paste designed for BGA reballing, SMD soldering, PCB repair, and mobile phone motherboard repair. Its Sn63/Pb37 alloy composition provides excellent solder wetting, smooth solder flow, and reliable solder joints with a nominal melting point of 183°C.
This Mechanic Flux Paste features fine solder particles of 24–45 µm, making it suitable for precision IC soldering, electronic component assembly, and fine-pitch PCB work. Its no-clean flux formula helps reduce oxidation and leaves minimal residue, which can be removed using suitable alcohol-based cleaning products when required.
The Mechanic XGZ40 35g Solder Paste comes in a convenient 10ml syringe for controlled application without additional preparation. Ideal for technicians searching for the best solder paste and flux for electronics, it supports accurate soldering with hot air rework stations, soldering equipment, and stencil applications. Store according to manufacturer instructions and handle with appropriate lead-solder safety precautions.
Key Features
- ✅ Sn63/Pb37 Alloy: 63% tin and 37% lead for reliable solder joints.
- ✅ 183°C Melting Point: Suitable for precision soldering and rework.
- ✅ Excellent Solder Wetting: Promotes smooth solder flow and strong connections.
- ✅ Fine Solder Particles: 24–45 µm particle size for accurate application.
- ✅ No-Clean Flux Formula: Reduces post-solder cleaning requirements.
- ✅ Smooth Consistency: Supports controlled dispensing and precise solder placement.
- ✅ BGA & SMD Compatible: Ideal for IC reballing, PCB assembly, and chip soldering.
- ✅ Easy Application: Convenient syringe packaging for professional repairs.
- ✅ Versatile Use: Suitable for mobile repair, laptop motherboards, and electronics assembly.
Product Specifications
| Specification | Details |
|---|---|
| Brand | Mechanic |
| Model Number | XGZ40 / XG-Z40 |
| Product Name | Mechanic XGZ40 Solder Paste |
| Product Type | Solder Paste with Flux |
| Alloy Composition | Sn63/Pb37 |
| Tin Content | 63% |
| Lead Content | 37% |
| Melting Point | 183°C (nominal alloy melting point) |
| Solder Particle Size | 24–45 µm |
| Flux Type | No-Clean |
| Net Weight | 35g |
| Volume | 10ml |
| Packaging Type | Syringe |
| Residue | Minimal, Generally No-Clean |
| Cleaning Method | Suitable Alcohol-Based Cleaner |
| Application | BGA Reballing, SMD Soldering & PCB Rework |
| Suitable For | Mobile Phones, Laptops & Electronic Components |
| Application Method | Syringe, Dispenser & Stencil |
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