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MiJing Z20 Pro Middle Layer Planting Tin Platform is a Professional Bga Reballing X-16/16Pro Max Pcb Bga Repair Mobile Phone Motherboard Repair Jig is Used for Placement And Reballing iPhone X-16Pro Max.
Product Features :-
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- iPhone X-16PM bga fixing tool. Used for positioning and reballing Pcb. More convenient and faster for bga reballing without any damage. Offer you the best solution for iphone X-16Pro Max bga reballing and repair.
Usage Tips :-
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- Take out the Z20 differential planters and place the lower place seals as needed (when planting tin inside the RF middle frame of the Max Xs motherboard, you need to place functional seals and then place the dedicated tin to plant grid) Place the main board and locate it through the positioning column and limit the column of the planted tin magnet according to the model to automatically adsorb the positioning hole and align the tin station and the tin location pin according to the requirements Use a tin scraper to fill the grid evenly.
How to install :-
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- Install the iPhone X-16Pro Max main board BGA reballing stencil Remove the tin mainballing stencil Remove the stencil reballing the motherboard and cooperate with the hot air gun to strengthen the tin point.
