MiJing ZG-183 Nano Solder Paste 10g Welding Flux PCB BGA SMT Soldering Tin Paste

MiJing ZG-183 Nano Solder Paste 10g Welding Flux PCB BGA SMT Soldering Tin Paste 

The Mijing ZG-183 Nano Solder Paste is a premium-quality flux paste designed for professional electronics repair, PCB assembly, and BGA/SMT soldering tasks. With its nano-formulated composition, this solder paste ensures excellent wettability, smooth solder flow, and strong adhesion, making it ideal for repairing mobile phones, laptops, and other electronic devices.

Whether you are a professional technician, electronics engineer, or hobbyist, the ZG-183 provides reliable, precise, and high-quality soldering results, reducing defects and improving workflow efficiency.

High-Performance Soldering Flux

The ZG-183 solder paste is engineered to enhance soldering efficiency and quality. Its nano-particle formula allows:

• Smooth and uniform solder flow
• Strong adhesion to PCBs, BGA, and SMT components
• Reduced bridging, oxidation, and solder ball formation
• Stable performance for both hand soldering and reflow soldering

This ensures consistent, professional-grade results, making it an essential tool for precision electronics repair.

Wide Application Range

Designed for versatile use in electronics assembly and repair, the Mijing ZG-183 solder paste is ideal for:

• PCB repair and rework
• BGA and SMT component soldering
• Mobile phone and tablet motherboard repair
• Laptop and computer circuit board maintenance
• DIY electronics projects and professional workshops

Its wide application range makes it suitable for both professional technicians and hobbyists, improving soldering quality across multiple devices and components.

Convenient and Easy to Use

The 10g packaging of the ZG-183 solder paste is compact, convenient, and easy to handle. Key user-friendly features include:

• Small, 10g bottle for precise dispensing
• Smooth consistency for easy application on pads and components
• Clean formulation to minimize residue and post-soldering cleaning
• Ready-to-use paste for efficient workflow

This ensures technicians can quickly apply the flux during repair or assembly tasks without mess or waste.

High-Quality Composition

Formulated with nano-sized particles and premium flux agents, the ZG-183 solder paste provides:

• Excellent wetting and solder joint quality
• Reduced defects and rework rates
• Strong adhesion to metals and PCB surfaces
• Consistent performance for both manual and machine soldering

Its high-quality composition ensures reliable, long-lasting solder connections, improving the durability and functionality of repaired electronic devices.

Why Choose Mijing ZG-183 Nano Solder Paste

• Nano-particle formula for smooth solder flow and strong adhesion
• 10g convenient bottle for precise, easy application
• High-performance flux for PCBs, BGAs, and SMT components
• Reduces soldering defects such as bridging and oxidation
• Ideal for mobile phone, laptop, and electronics repair
• Professional-grade quality for technicians, engineers, and hobbyists

Applications

• PCB repair and maintenance
• BGA and SMT component soldering
• Mobile phone and tablet motherboard repair
• Laptop and computer circuit board assembly
• DIY electronics and professional workshop use

Professional-Grade Soldering for Electronics

The Mijing ZG-183 Nano Solder Paste (10g) is an essential tool for anyone working with PCBs, BGA chips, or SMT components. Its high-performance formula, smooth flow, and reliable adhesion make soldering faster, cleaner, and more precise.