Qianli Middle Frame Reballing Platform For iPhone X/XS/XS Max (Upgraded)

Qianli Middle Frame Reballing Platform For iPhone X/XS/XS Max (Upgraded)

Product Features :-

• Custom-fitted for iPhone X, XS, and XS Max middle frames.
• Ensures perfect positioning of BGA chips during reballing and repair.
• Made from high-quality, heat-resistant materials.
• Supports high-temperature soldering processes without warping.
• Adjustable fixture system to hold middle frame securely.
• Prevents movement during the reballing process for maximum accuracy.
• Upgraded mechanical structure for enhanced durability.
• Resistant to wear from frequent use in professional repair environments.

The QianLi Middle Frame Reballing Platform is a professional-grade tool designed for precise motherboard and IC repair on iPhone XX, XS, and XS Max devices. This upgraded reballing platform provides stable, accurate positioning of motherboards and chips, making BGA reballing, IC replacement, and micro-soldering operations more efficient and reliable.

Crafted for professional technicians and mobile repair centers, the platform ensures non-destructive handling of delicate motherboards, reducing the risk of damage during soldering, testing, or reballing procedures. Its innovative design and durable construction make it a must-have tool for modern smartphone repair.

Key Features and Benefits

• Upgraded Design for iPhone XX/XS/XS Max:
  Perfectly compatible with iPhone XX, XS, and XS Max motherboards, ensuring secure positioning and precise alignment during reballing and repair.

• Stable Middle Frame Platform:
  Provides firm support for motherboards, preventing movement or slipping during soldering or micro-rework.

• Non-Destructive Operation:
  Designed to protect sensitive components from bending, scratches, or heat damage while allowing precise repair work.

• Versatile Applications:
  Ideal for BGA reballing, IC replacement, chip soldering, motherboard testing, and other delicate repair tasks.

• Durable Construction:
  Made from high-quality materials, the platform is built to withstand frequent use in repair shops and labs.

• Enhanced Precision:
  Adjustable clamps and alignment guides ensure accurate positioning of chips and ICs, reducing errors and improving repair quality.

• Professional-Grade Tool:
  Trusted by mobile repair technicians and refurbishing centers for consistent, reliable performance in smartphone motherboard repairs.

Technical Specifications

Applications

The QianLi Middle Frame Reballing Platform is perfect for:

• BGA reballing of iPhone motherboards

• IC replacement and chip soldering

• Precision motherboard repair

• Mobile repair shops and professional refurbishing centers

Its stable platform and upgraded design ensure technicians can perform repairs efficiently, safely, and with high precision, improving workflow and repair quality.

How to Use

1. Place the iPhone motherboard securely on the middle frame platform.

2. Adjust the clamps and alignment guides to fit the motherboard or chip precisely.

3. Perform BGA reballing, IC replacement, or micro-soldering using a hot-air station or soldering tools.

4. After the repair, carefully release the motherboard and inspect solder joints or chip placement.

5. Repeat as needed for additional repairs or testing.

Tip: Use in a dust-free and heat-controlled environment to achieve optimal results and prevent damage to delicate components.

Why Choose QianLi Middle Frame Reballing Platform

The QianLi Middle Frame Reballing Platform delivers precision, durability, and professional reliability for iPhone motherboard repairs. Its upgraded design, secure platform, and adjustable alignment features ensure that BGA reballing, IC replacement, and micro-soldering can be done efficiently, safely, and accurately, making it an essential tool for mobile repair technicians and electronics labs.