Qianli QS47 Bumblebee Stencil For Samsung 8

119.00₹~~300.00₹~~

SKU:BT8842

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It is used for precise solder paste application and reballing of BGA chips on Samsung 8.2 mm devices.

Designed for Samsung devices with an 8.2 mm BGA chip layout.

BGA reballing stencil for accurate solder paste placement during motherboard and chip repair.

High-quality stainless steel for durability, heat resistance, and repeated use.

119.00₹~~300.00₹~~

What is the Qianli QS47 Bumblebee Stencil used for?