Qianli QS50 Bumblebee Stencil For Samsung 11

119.00₹~~300.00₹~~

SKU:BT8845

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It is designed for precise solder paste application and reballing of BGA chips on Samsung 11.2 mm devices.

Specifically designed for Samsung devices with an 11.2 mm BGA chip layout.

High-quality stainless steel for durability, heat resistance, and repeated use.

Typically 0.12–0.15 mm, optimized for precise solder paste application.

119.00₹~~300.00₹~~

What is the Qianli QS50 Bumblebee Stencil used for?