Qianli QS55 Bumblebee Stencil For Huawei 4

119.00₹~~300.00₹~~

SKU:BT8861

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It is designed for precise solder paste application and reballing of BGA chips on Huawei 4.2 mm devices.

Specifically designed for Huawei devices with a 4.2 mm BGA chip layout.

High-quality stainless steel for durability, heat resistance, and repeated use.

Typically 0.12–0.15 mm, optimized for precise solder paste application.

119.00₹~~300.00₹~~

What is the Qianli QS55 Bumblebee Stencil used for?