WL-55 MSM8994 MSM8974 HI3650 HI3660 CPU RAM IC Chip BGA Reballing Stencil For Huawei phone
in stock
Original price was: ₹313.78.₹208.14Current price is: ₹208.14.34% OFF
Additional information
| Weight | 0.25 kg |
|---|
Only logged in customers who have purchased this product may leave a review.
Related products
-
-10%STENCIL SET A8 A9 A10 A11 FOR CPU REPAIR WITH MAGNATE BASE
Original price was: ₹2,601.93.₹2,340.43Current price is: ₹2,340.43. Add to cart -
-50% -
Sold out
-
-
Sold out
-
-23%Phone 8 BLACK STENCIL S450
Original price was: ₹380.72.₹293.71Current price is: ₹293.71. Add to cart
