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WYLIE WL-716L Magnetic Rubber Pad Universal BGA Reballing Stencil Absorption Silicone Mat Mobile Phone CPU IC Repair Pad

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Description

WYLIE WL-716L Magnetic Rubber Pad Universal BGA Reballing Stencil Absorption Silicone Mat Mobile Phone CPU IC Repair Pad

Product Features :-

High-quality magnetic rubber pad for stable IC placement
Strong absorption surface prevents stencil slipping
Heat-resistant silicone material for safe BGA reballing work
Designed for mobile phone CPU and IC repair tasks
Universal compatibility with various BGA stencils
Non-slip surface ensures precision and accuracy
Flexible and durable for long-term use
Easy to clean and maintain
Compact design, suitable for repair workstations
Ideal tool for professional mobile repair technicians

Additional information

Weight	0.2 kg

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