Description
2UUL BG01 ABCD BGA Reballing Stencil Kit for iPhone 8-16 Pro Max For iPhone CPU/Hard Disk/Face ID/Screen IC/Camera Repair
Product Features :-
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Compatible with iPhone 8 to iPhone 16 PM
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Reballing stencil for precise solder ball placement
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Heat-resistant, durable, and long-lasting material
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Ideal for motherboard repair, chip replacement, and reballing
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Pack contains 4 stencils for multiple repair tasks
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Suitable for professional technicians and DIY repair enthusiasts
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Stencil Work :-
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A Model Stencil : CPU IC / Nand Flash IC
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B Model Stencil : Baseband IC / WiFi IC
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C Model Stencil : Radio Frequency IC / Power Amplifier IC / Small IC
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D Model Stencil : Screen IC / Face ID Module / Charging Port Flex Cable / Proximity Sensor
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/ True Tone Sensor / Camera Module
The 2UUL BG01 ABCD BGA Reballing Stencil Kit is a premium, all-in-one toolkit specifically designed for professional iPhone motherboard repair and IC reballing. Compatible with iPhone 8, 8 Plus, X, and 16 Pro/Max, this kit provides precise tools for CPU, NAND, Face ID, camera, hard disk, and IC module repair, ensuring professional-grade results for complex chip-level repairs.
- Whether you?re a mobile repair technician, electronics engineer, or advanced DIY enthusiast, the 2UUL BG01 kit offers accuracy, durability, and efficiency needed to restore iPhone devices to perfect working condition.
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Comprehensive ABCD Stencil Kit for iPhone Repairs
- The kit features ABCD BGA stencils carefully engineered to cover critical iPhone components, including:
- CPU and GPU reballing
- NAND and memory IC repair
- Face ID module and camera IC rework
- Hard disk and logic IC soldering
- Each stencil is laser-cut with micro-precision holes to ensure perfect solder ball alignment, consistent reflow, and professional-quality repairs.
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Premium Stainless Steel Construction
- Each stencil in the 2UUL BG01 kit is crafted from high-grade stainless steel, offering durability, heat resistance, and corrosion protection. The key material features include:
- 0.12mm?0.15mm ultra-thin profile for optimal heat transfer
- Laser-etched micro-holes for precise solder ball placement
- Smooth anti-stick surface to prevent solder residue accumulation
- Warp- and corrosion-resistant design for repeated use
- This construction ensures the stencil maintains flatness and accuracy during multiple reflow cycles, making it suitable for high-volume professional repair environments.
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Optimized for iPhone CPU and IC Rework
- The 2UUL BG01 stencil kit is designed for precision alignment and soldering on iPhone motherboards. It is perfect for:
- BGA reballing on iPhone CPUs and GPUs
- NAND flash and memory IC chip repair
- Face ID, camera module, and sensor IC repairs
- Hard disk and logic IC maintenance
- With precise hole alignment and superior heat conduction, the kit ensures clean soldering results, reducing the risk of bridging, misalignment, or solder joint failure.
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Easy-to-Use and Efficient
- The 2UUL BG01 kit is compatible with both manual and automated reballing setups. Simply:
- Align the stencil over the chip
- Apply solder paste or preformed solder balls
- Heat evenly with a reflow or hot air station
- The anti-stick surface ensures easy solder ball release, while the stainless steel construction allows multiple reuse cycles without affecting performance. This kit significantly reduces repair time and improves success rates, making it ideal for professional service centers.
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Why Choose the 2UUL BG01 ABCD Kit
- Complete ABCD stencils for full iPhone repair coverage
- Laser-cut precision holes for accurate solder alignment
- Durable stainless steel construction for long-term use
- Ultra-thin design (0.12?0.15mm) for efficient heat transfer
- Compatible with iPhone 8, 8 Plus, X, 16 Pro, and Max
- Reusable, easy to clean, and reliable
- Professional-grade solution for repair shops and technicians
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Applications
- iPhone CPU, GPU, and NAND IC reballing
- Face ID, camera, and sensor IC module repair
- Hard disk and memory IC soldering
- Professional BGA micro-soldering and rework
- Electronics repair workshops and training labs
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Professional iPhone Repair Made Easy
- The 2UUL BG01 ABCD BGA Reballing Stencil Kit provides precision, durability, and efficiency required by professional iPhone repair technicians. With laser-cut stencils, premium stainless steel construction, and reusable design, it ensures accurate solder ball placement and flawless reflow every time.
- For high-quality motherboard, CPU, NAND, Face ID, camera, and hard disk IC repairs, the 2UUL BG01 kit is the ultimate tool trusted by repair professionals worldwide.
