Description

2UUL BH11 Universal Mobile Motherboard Mid Frame Reballing Magnetic Pad
Product Features :-
  • Universal design for most mobile phone motherboards
  • Strong magnetic surface holds frame and parts firmly in place
  • Helps keep motherboard stable during reballing and repair work
  • Mid-frame structure supports accurate chip positioning
  • Heat resistant material for safe soldering operations
  • Improves precision and reduces slipping while working
  • Compact and easy to use on repair workstations
  • Ideal for reballing, chip removal, and motherboard fixing

Additional information

Weight 0.2 kg

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