Description
2UUL SNK Series PPD Solder Paste 148°C
Product Specification :-
- Brand………………………..2UUL
- Temperature………………148°c
- Type………………………….PPD
- Model………………………..SNK 148
- Weight……………………….50G
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2UUL SC91 148C SNK Solder Paste – Premium Low-Temperature Tin Paste for iPhone X Series BGA Chip Repair
Ensure professional-grade motherboard repair with the 2UUL SC91 148C SNK Solder Paste. This high-quality, low-temperature tin paste (melting point: 189°C) is specifically formulated for iPhone X, XR, Xs, and Xs Max layered motherboards, delivering superior performance in BGA chip soldering.
High Purity & Strong Adhesion: Provides excellent wetting and bonding, ensuring strong, reliable connections. Low-Temperature Melting (148°C): Reduces thermal stress on sensitive components, preventing motherboard damage. Ideal for BGA Rework & Soldering: Ensures smooth application for reballing, stencil work, and chip-level repairs. Specially Designed for High-End Smartphones: Trusted by professionals in the mobile repair industry. 100% Brand New & High Quality: Every batch is quality-checked to ensure consistency and performance.-
Apply evenly to the soldering area using a stencil or precision applicator.
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Use a hot air rework station or reflow oven at a controlled temperature.
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Allow the paste to melt and form secure, conductive joints.
