Description
Amaoe 1+11 Middle Layer BGA Reballing Stencil For OnePlus 11
??? Amaoe 1+11 Middle Layer BGA Reballing Stencil For OnePlus 11 ? Precision Meets Perfection
Take your rework and reballing skills to the next level with the Amaoe 1+11 Middle Layer BGA Reballing Stencil for OnePlus 11. Engineered for high-accuracy repairs, this stencil is the ultimate tool for technicians dealing with motherboard-level work.
?? Built for Reballing Professionals
The Amaoe BGA Reballing Stencil for OnePlus 11 is designed specifically to match the middle layer architecture of the OnePlus 11. With ultra-precise apertures, it ensures accurate placement of solder paste or solder balls during chip-level repairs?essential for restoring BGA chips to factory performance.
?? Durable, Reliable, Long-lasting
Made from high-grade stainless steel, the stencil withstands repeated high-heat exposures without warping. Whether you’re working with hot air stations or infrared machines, the Amaoe 1+11 Middle Layer BGA Reballing Stencil for OnePlus 11 delivers consistent results every time.
?? Why Choose This Stencil?
? Exact-fit design for OnePlus 11 middle layer ICs
? Saves time and prevents soldering mistakes
? Ideal for both reballing and fresh installations
? Trusted by mobile repair professionals across India
?? How to Use
Place the stencil over the IC or PCB, align the apertures precisely, then apply solder paste using a scraper. Heat the component to bond the solder balls?simple, efficient, and accurate.
? Trusted Quality with Confidence
Amaoe is a globally respected name in micro soldering, and this reballing stencil is no exception. When you invest in the Amaoe 1+11 Middle Layer BGA Reballing Stencil for OnePlus 11, you choose precision, quality, and reliability.
