Description
Amaoe 1+9P Middle Layer BGA Reballing Stencil for OnePlus 9Pro
?? Amaoe 1+9P Middle Layer BGA Reballing Stencil for OnePlus 9 Pro ??
Take your mobile repair game to the next level with the Amaoe 1+9P Middle Layer BGA Reballing Stencil ? designed specifically for precision work on the OnePlus 9 Pro. Whether you’re an expert technician or a mobile repair enthusiast, this stencil ensures perfect soldering and flawless reballing every time.
?? Purpose & Application
This BGA stencil is engineered to simplify two critical processes: the application of solder paste and reballing of middle-layer chips. The precisely cut apertures align perfectly with the solder pads on the OnePlus 9 Pro logic board, ensuring even distribution of solder paste or solder balls ? no smudges, no guesswork.
?? High-Precision Aperture Design
The laser-cut design provides uniform aperture dimensions, allowing smooth paste flow and accurate deposition. The stencil is ideal for applying solder on fine-pitch BGAs, especially for ICs on the OnePlus 9 Pro middle layer.
?? Durable Build & Reliable Performance
Crafted from high-grade stainless steel, this reballing stencil resists warping and heat damage even after repeated use. Whether you’re working with hot air or infrared rework stations, the stencil maintains its shape and alignment under pressure.
? Why Buy This Stencil?
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Specifically designed for the OnePlus 9 Pro
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Increases accuracy and speed during soldering
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Reusable and highly durable material
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Essential for professional BGA reballing and chip-level repair
?? Trust Amaoe for precision. Trust quality. Trust results.
Get your Amaoe 1+9P Middle Layer BGA Reballing Stencil for OnePlus 9 Pro now and deliver repairs that speak for themselves. Because in the world of mobile repairing, accuracy is everything ? and this stencil delivers it, every single time.
