Description
Amaoe HW4 Stencil
reinforce your soldering and reballing precision with this high-quality stainless steel stencil, designed for precise application of solder paste to PCB pads. Whether you?re repairing a mobile phone motherboard, gaming console, or any BGA chip, this stencil ensures accurate solder deposition for a flawless connection.
Key Features:
? High-Precision Apertures ? Designed for perfect alignment with PCB solder pads, ensuring uniform solder application.
? Premium Stainless Steel Build ? Resistant to heat, warping, and corrosion, making it ideal for long-term use.
? Versatile Usage ? Perfect for solder paste application during surface-mount device (SMD) assembly and BGA reballing.
? Compatible with Specific Models ? Ensures a perfect fit for various chipsets and circuit boards.
?? Ensures Stronger Solder Joints ? Reduces errors and rework, ensuring a professional-grade soldering job.
?? Increases Work Efficiency ? Speeds up solder paste application, improving repair accuracy.
?? Trusted by Technicians ? Preferred by experts in mobile and electronics repair for its consistency and precision.
1?? Place the stencil over the PCB/component.
2?? Apply solder paste evenly using a scraper.
3?? Remove the stencil carefully to reveal the paste-applied pads.
4?? Proceed with reflow soldering for a secure bond.
