Description

Amaoe N970-012 Middle Layer BGA Reballing Stencil For Samsung Note 10

Amaoe SM-N970U 9700 Middle Layer BGA Reballing Stencil For Samsung Note 10

Upgrade your mobile repairing toolkit with the Amaoe SM-N970U 9700 BGA Reballing Stencil, a precision-engineered solution designed exclusively for Samsung Note 10 middle layer ICs. This high-quality stencil ensures accuracy, efficiency, and consistency for professional-level reballing and solder paste application.


Purpose & Precision

This Amaoe SM-N970U 9700 BGA Reballing Stencil is crafted for exact solder paste deposition during motherboard repair. Ideal for surface-mount device (SMD) work, the stencil features micro-accurate apertures that perfectly align with the solder pads on Samsung Note 10 PCBs. It helps secure components during reflow, improving your repair quality and reliability.


Reballing Made Easy

Whether you’re restoring a BGA chip or replacing an IC, this stencil streamlines the reballing process. Just place the stencil over the chip or board, apply solder paste or balls, heat using a rework station, and enjoy clean, accurate solder joints every time.


High Durability & Trusted Quality

Made from premium stainless steel, the Amaoe SM-N970U 9700 BGA Reballing Stencil resists warping, corrosion, and thermal stress. It?s reusable, easy to clean, and engineered for long-term use in busy repair labs. Trusted by professional technicians across India.


Why Choose Amaoe?

  • Device Compatibility: Tailored for Samsung Note 10 middle layer repair

  • Professional Finish: Enhances soldering precision and component stability

  • Reusable: Built for durability and repeat performance

  • Trusted Tool: Part of every pro technician?s must-have kit


Ideal for Mobile Repair Engineers

This Amaoe SM-N970U 9700 BGA Reballing Stencil is your key to clean, professional Samsung Note 10 repairs. Reliable, accurate, and built for pros?buy now and level up your repair results.

Additional information

Weight 0.1 kg