Amaoe S928U-012 Middle Layer BGA Reballing Stencil For Samsung S24 Ultra

Amaoe S928U-012 Middle Layer BGA Reballing Stencil For Samsung S24 Ultra

Unlock precision and performance with the Amaoe S928U-012 BGA Reballing Stencil for Samsung S24 Ultra ? an essential tool for expert-level PCB repair and reballing. Designed specifically for the middle layer of the Samsung S24 Ultra motherboard, this stencil ensures accurate solder paste application for even the most intricate BGA chip layouts.

Precision You Can Trust

This BGA reballing stencil for Samsung S24 Ultra features a meticulously crafted aperture design, allowing for perfect alignment with solder pads on the PCB or IC. Each tiny hole ensures that the right amount of solder paste or balls is applied, enhancing both reflow quality and component stability. Whether you’re replacing or reballing high-density chips, this stencil is built to handle the job with surgical accuracy.

Built to Last

Made from high-grade stainless steel, the Amaoe S928U-012 stencil can withstand the high heat and repeated use typical in professional repair labs. It won?t warp, corrode, or degrade under pressure?ensuring consistent performance across multiple jobs.

Why Choose Amaoe for Reballing?

• Device-specific design: Custom-fit for Samsung S24 Ultra’s middle-layer ICs
• Durable material: Premium stainless steel for long-term reliability
• Professional results: Cleaner soldering, reduced errors, and improved IC stability
• Easy to use: Just align, apply paste, and reball with confidence

How to Use

Simply align the stencil over the BGA chip or PCB pad, apply solder paste or solder balls through the apertures, and reflow. This ensures precision placement for seamless reballing every time.

Upgrade your repair game with the Amaoe S928U-012 BGA reballing stencil for Samsung S24 Ultra ? your trusted partner for high-quality, reliable, and efficient soldering work.