Description
Features:
Tailored specifically for the Sam-18 For Samsung series , ensuring a perfect fit for precise repair work.
Detailed outlines for accurate application of soldering paste or for guiding component placement.
Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
Strategically placed holes to provide even distribution of soldering paste and minimize waste.
Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
The stencil can be easily cleaned with standard solvent to ensure long-term usability.
Comes with appropriate packaging to protect against bending and damage during storage or transport.
