Description
AMAOE U-QSU2 STENCIL?
AMAOE U-QSU2 Stencil for QUALCOMM CPU & RAM ? Precision Reballing Made Easy
The AMAOE U-QSU2 Stencil for QUALCOMM CPU & RAM is a premium-quality tool designed for technicians who demand precision, consistency, and reliability in mobile repair. Crafted from durable, high-grade stainless steel, this stencil ensures long-lasting performance even with repeated use under high temperatures.
Whether you’re performing reballing on BGA chips or applying solder paste to PCBs, this stencil guarantees accurate alignment and clean results. Each stencil is engineered with micro-precision apertures that perfectly match the layout of supported QUALCOMM models. This ensures the exact quantity of solder is deposited, reducing the chances of bridging, cold joints, or other common soldering issues.
Supported Models:
625-MSM8953 1AB, 210-MSM8909, 425-MSM8917, 617-MSM8952, SDM450/632 MSM8953 B01, 410-MSM8916, 615-MSM8939, 430-MSM8937, 435-MSM8940, 636-SDM636, 660-SDM660.
How to Use:
Secure the stencil over the chip or PCB using a reballing frame or tape. Apply solder paste or solder balls through the stencil. Use a heat gun or reflow station to complete the process. Easy to use and extremely precise ? ideal for professional mobile repair experts.
Why Choose AMAOE U-QSU2 Stencil?
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- High precision for error-free soldering
- Built to last ? resistant to wear and heat
- Trusted by professionals for QUALCOMM chip repair
- Increases success rate in CPU and RAM reballing jobs
