Description
Amaoe HW4 Stencil
reinforce your soldering and reballing precision with this high-quality stainless steel stencil, designed for precise application of solder paste to PCB pads. Whether you’re repairing a mobile phone motherboard, gaming console, or any BGA chip, this stencil ensures accurate solder deposition for a flawless connection.
Key Features:
✔ High-Precision Apertures – Designed for perfect alignment with PCB solder pads, ensuring uniform solder application.
✔ Premium Stainless Steel Build – Resistant to heat, warping, and corrosion, making it ideal for long-term use.
✔ Versatile Usage – Perfect for solder paste application during surface-mount device (SMD) assembly and BGA reballing.
✔ Compatible with Specific Models – Ensures a perfect fit for various chipsets and circuit boards.
🔹 Ensures Stronger Solder Joints – Reduces errors and rework, ensuring a professional-grade soldering job.
🔹 Increases Work Efficiency – Speeds up solder paste application, improving repair accuracy.
🔹 Trusted by Technicians – Preferred by experts in mobile and electronics repair for its consistency and precision.
1️⃣ Place the stencil over the PCB/component.
2️⃣ Apply solder paste evenly using a scraper.
3️⃣ Remove the stencil carefully to reveal the paste-applied pads.
4️⃣ Proceed with reflow soldering for a secure bond.
