Description

JTX Fixst Screen IC Reballing Stencil For iPhone 12Mini/ 13/ 13 Mini/ 14/ 14Plus/ 15/ 15Plus

The JTX FIXST Screen IC Reballing Stencil is a high-precision, durable, and professional-grade tool designed for mobile phone motherboard and IC repair. Engineered for modern iPhone devices from iPhone 12 Mini up to iPhone 15 Plus, this stencil ensures accurate solder ball placement while protecting delicate screen ICs during BGA reballing and micro-soldering operations.

This stencil is an essential tool for professional technicians, repair centers, and electronics enthusiasts, providing consistent results, reduced rework, and improved solder joint reliability. Its laser-cut precision ensures perfect alignment, making IC replacement and reballing faster, safer, and more efficient.


Key Features and Benefits

  • Screen IC Protection Design:
    The stencil features protective barriers that shield sensitive screen ICs and flex cables from accidental contact or damage during BGA reballing or soldering.

  • High-Precision Alignment:
    Ensures exact solder ball positioning on IC pads, reducing errors and ensuring clean, reliable solder joints.

  • Durable, Heat-Resistant Material:
    Crafted from premium stainless steel, this stencil withstands repeated high-temperature soldering and reflow cycles, providing long-term durability for professional repair environments.

  • Wide Compatibility (iPhone 12 Mini ? 15 Plus):
    Specifically designed for iPhone models including:

    • iPhone 12 Mini

    • iPhone 13 / 13 Mini

    • iPhone 14 / 14 Plus

    • iPhone 15 / 15 Plus

  • Efficient BGA and IC Reballing:
    Streamlines the soldering process, allowing technicians to deposit solder balls quickly and evenly, reducing repair time and improving workflow efficiency.

  • Professional-Grade Standard:
    Ideal for mobile repair shops, refurbishment centers, and electronics labs, ensuring consistent, high-quality results.

  • Compact and Easy to Use:
    Lightweight and portable, the stencil can be easily integrated into any workstation without occupying excessive space.


Technical Specifications

Specification Details
Brand JTX
Model FIXST Screen IC Reballing Stencil
Type Screen IC Protection BGA Reballing Stencil
Material High-quality stainless steel
Compatibility iPhone 12 Mini / 13 / 13 Mini / 14 / 14 Plus / 15 / 15 Plus
Design Protective barriers for screen ICs and flex cables
Thickness Approx. 0.12 mm (laser-cut precision)
Reusability Suitable for multiple reballing cycles
Weight Approx. 25g
Applications IC reballing, BGA repair, soldering precision
Condition 100% brand new, factory sealed

Applications

The JTX FIXST Screen IC Reballing Stencil is ideal for:

  • BGA IC reballing on iPhone motherboards
  • Replacing screen ICs without damaging flex cables

  • Precise solder ball deposition for micro-soldering

  • Reflow soldering and IC repair operations

Its protective design and high precision make it a must-have tool for iPhone repair technicians.


How to Use

  1. Align the stencil over the IC pads on the iPhone motherboard.
  2. Secure it in place using tape or a temporary fixture to prevent movement.

  3. Evenly fill the stencil openings with solder balls.

  4. Heat the board using a hot air station or reflow oven until solder balls adhere.

  5. Carefully remove the stencil and inspect the solder joints for consistency.

Tip: Always ensure flex cables and screen ICs remain protected and do not come into contact with heat or solder.


Why Choose JTX FIXST Stencil

The JTX FIXST Screen IC Reballing Stencil provides precision, durability, and protection in a single tool. Its laser-cut stainless steel construction with IC protection barriers reduces errors, prevents component damage, and ensures high-quality soldering results.

Trusted by professional repair shops and technicians, this stencil guarantees consistent, repeatable, and reliable IC reballing for the latest iPhone models, improving both workflow efficiency and repair quality

Additional information

Weight 0.09 kg

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