Description
The JTX SM01 iPhone 8/8 Plus IP Swap Board & Chips Reballing Platform is a professional-grade tool engineered for technicians who demand reliability, accuracy, and efficiency during chip-level repairs. Designed specifically for iPhone 8 and iPhone 8 Plus logic board work, this versatile platform provides a stable, heat-resistant environment for BGA reballing, chip swapping, and motherboard alignment tasks. It is an essential piece of equipment for repair experts handling Face ID issues, baseband failures, audio IC defects, storage replacements, and overall logic board refurbishing.
Crafted from durable, high-density alloy materials, the blue module offers exceptional thermal stability, ensuring even heat distribution during hot-air rework. This helps prevent board warping and component damage while making reballing procedures smoother and more consistent. The integrated positioning frame holds the chip securely in place, reducing the risk of movement or misalignment during stencil operations. Its precision machined mold ensures that every component fits perfectly, supporting repeated use in high-volume repair environments without losing structural integrity.
Included with the platform is a high-accuracy stainless steel stencil specifically matched to the chip layout of the targeted iPhone models. The stencil?s ultra-fine mesh allows for consistent and clean solder paste application, resulting in uniform solder balls and excellent adhesion. Whether you are reballing baseband, PMIC, audio IC, or other small BGA chips, this toolset delivers the level of detail and accuracy required for seamless professional results.
The JTX SM01 enhances technician workflow by streamlining chip preparation. Its modular design allows fast positioning and removal, enabling users to work quickly without compromising quality. It minimizes manual adjustments, helping reduce errors and improve efficiency across repetitive tasks. The platform is also compatible with common repair shop equipment, including hot air stations, pre-heaters, and microscopes.
Because chip-level repairs require absolute steadiness and heat control, this board?s heat-resistant material and solid weight provide excellent balance. It keeps the board firmly in place during rework so you can focus entirely on precision. This makes it ideal for expert technicians tackling delicate reballing tasks where millimeter-level alignment matters.
Whether you’re restoring water-damaged boards, repairing common iPhone 8/8 Plus issues, or conducting full logic board refurbishing, the JTX SM01 reballing module offers the stability, accuracy, and professional craftsmanship needed for high-standard results. With its premium build, easy operation, and repair-focused design, this tool has become a trusted choice for advanced mobile phone repair labs worldwide.
