Description
Innovative technology for removing glue from pads, creating a glue removal blade that won’t damage the pad. when removing the glue, it can provide better protection of chip’s pads no damage and no solder joint dropped.
AUTONOMOUS GRINDINGÂ
- Polish according to your needs , yous exclusive sharp tools
REMOVE GLUE WITHOUT TRACE
Clean the residual glue and edge glue of the pad quickly without leaving trace
