Description
MECHANIC SOLDER BALL 0.25MM LEAD FREE BGA SOLDER BALL
MECHANIC XZ10 0.25mm Solder Ball – Precision Welding for Professional Chip-Level Repair
Ensure flawless motherboard, hard disk, baseband, and BGA chip repairs with the MECHANIC XZ10 0.25mm Solder Ball. Engineered for precision and reliability, these leaded tin beads (Sn63/Pb37 composition) deliver strong, stable joints for demanding micro-welding tasks. Each bottle contains 10,000 high-purity, perfectly spherical solder balls, free from surface defects, ensuring optimal flow and adhesion during soldering.
Manufactured to meet EU ROHS and REACH environmental standards, the MECHANIC solder ball offers superior oxidation resistance, excellent mechanical strength, and outstanding thermal fatigue performance — making it the trusted choice for professionals handling delicate, high-value components like BGA, CSP, and advanced chip packaging.
Whether you’re using a rework station or an automatic solder ball placement machine, the XZ10 ensures smooth calibration and allows for minor placement variances without compromising repair quality.
Why choose MECHANIC? The answer is simple: assured quality, trusted performance, and professional-grade results. Ideal for technicians, repair shops, and serious DIYers, this solder ball is designed for flawless solder joints, reducing failure rates and extending device lifespan.
Invest in MECHANIC XZ10 for every repair that demands precision and reliability — your clients’ devices deserve nothing less.
