Description

Mechanic XG50 Solder Paste 183?C Degree Melting Point For SMD Rework BGA IC Reballing Paste

Product Features :-

  • Melting point: 183?C
  • Suitable for SMD, BGA, and IC reballing
  • Sn63/Pb37 alloy composition
  • Good viscosity for smooth application
  • Strong adhesion for reliable solder joints
  • Easy to use and clean
  • Stable performance for rework and repair

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