Description
MIJING Z20 10 in 1 BGA Reballing Metal Stencil For IPhone X 11 12Series Motherboard Middle Layer Reballing Platform
MIJING Z20 10-in-1 BGA Reballing Metal Stencil for iPhone X/11/12 Series Motherboard ? Premium Reballing Platform for Professionals
The MIJING Z20 10-in-1 BGA Reballing Metal Stencil is a high-precision reballing solution designed specifically for professionals working on iPhone X, 11, and 12 series motherboards. Crafted from durable, high-grade stainless steel, this stencil set ensures long-lasting performance, perfect alignment, and precision soldering?making it an essential tool for advanced logic board repair.
This product includes 10 specialized stencil templates engineered to match the middle layer of various iPhone motherboard chips. The ultra-thin metal design provides consistent heat resistance, fast heat transfer, and tight positioning, reducing solder paste overflow and improving reballing success rates.
? Trusted by repair experts worldwide
? Accurate chip-to-stencil fit with minimal deviation
? Saves time and improves workflow efficiency
? Reusable, anti-deformation, and corrosion-resistant
Place the motherboard or IC in the MIJING reballing platform, align the stencil, apply solder paste, and heat evenly. The result is a clean and precise solder ball formation?ideal for successful chip rebonding.
Whether you’re a repair shop technician or a serious DIY enthusiast, MIJING Z20 offers reliability, precision, and professional-grade results?making it a smart and trustworthy investment in your repair toolkit.
