Description

Soldering Paste For BGA Sn63pb37 (Half KG)

  • 100% Brand New
  • High Quality
  • Joint high intensity.
  • Good insulating ability.
  • Soldering paste for cell phone PCB and SMD like BGA, PGA, etc.
  • Help to repair the circuit boards and protect the electronic components.
  • A necessary material for repairing the mobile phone mainboard.
  • Image shown can be different from the actual product.
  • It contains chemical composition, please be careful when you use it.