Description

XZZ SR17E Stencil Laptop CPU IC Reballing Stencil

The XZZ SR17E Laptop CPU IC Reballing Stencil is a high-precision, professional-grade tool designed for CPU, GPU, and IC chip reballing on laptop motherboards and other advanced electronic devices. Made from premium stainless steel and manufactured with laser-cut accuracy, this stencil is built to deliver perfect results for every reballing task?making it a must-have for technicians, micro-soldering experts, and electronic repair professionals.

Whether you?re performing motherboard repairs, chip replacements, or BGA rework, the XZZ SR17E ensures clean, consistent, and professional-quality reballing every time.


Engineered for Professional Reballing Precision

The XZZ SR17E stencil is designed for one purpose?perfect solder ball alignment on laptop CPUs, GPUs, and integrated circuit (IC) chips. Reballing is an essential process in electronic repair, used to restore electrical connections on BGA (Ball Grid Array) chips that have been removed or repaired.

Featuring laser-cut micro-holes and an ultra-thin 0.12mm stainless steel frame, this stencil ensures uniform solder ball formation, precise alignment, and reliable bonding. Its ultra-fine design guarantees even heat distribution during soldering, reducing the risk of bridging or misalignment and resulting in factory-quality repair finishes.


Premium Stainless Steel Construction

Durability meets precision in the XZZ SR17E stencil, crafted from high-quality stainless steel to withstand repeated heating cycles without warping, bending, or corroding.

Key material features include:

  • Ultra-thin (0.12mm) high-precision steel for efficient heat transfer

  • Laser-etched hole design for perfect solder placement

  • Smooth anti-stick surface to prevent solder residue buildup

  • Corrosion and oxidation resistance for long lifespan

  • Excellent flatness to ensure consistent reballing results

This superior construction ensures that the stencil maintains its shape and accuracy, even after multiple reflow operations, making it ideal for professional workshop environments.


Perfect for Laptop CPU and IC Chip Rework

The XZZ SR17E stencil is specifically designed for laptop CPU, GPU, and memory IC reballing, compatible with a wide range of chipsets from major brands such as Intel, AMD, and NVIDIA.

It is suitable for:

  • Laptop motherboard IC chip repair

  • CPU and GPU BGA reballing

  • RAM and power IC soldering

  • Component rework and replacement

This stencil provides precise alignment and compatibility with modern laptop architectures, helping technicians achieve reliable, high-quality results during chip-level repairs.


Effortless and Efficient Use

Designed for both manual and automated reballing setups, the XZZ SR17E ensures ease of use and efficiency. Simply align the stencil over the chip, apply solder paste or place solder balls, and heat evenly using a reflow station or hot air gun.

Thanks to its fine laser-cut openings and smooth surface finish, the stencil allows for even solder distribution, fast melting, and clean detachment once the process is complete. Its reusable design and easy-clean surface make it cost-effective and convenient for professional repair centers.


Why Choose the XZZ SR17E Reballing Stencil

  • Precision laser-cut micro-holes for accurate solder alignment

  • Made from durable stainless steel for long-term use

  • Resistant to heat, oxidation, and deformation

  • Ultra-thin (0.12mm) for perfect heat conduction

  • Ideal for laptop CPU, GPU, and IC reballing

  • Reusable and easy to maintain

  • Compatible with professional and manual rework systems


Applications

  • Laptop CPU and GPU reballing

  • Motherboard IC repair and replacement

  • BGA chip soldering and training

  • Micro-soldering and electronic component restoration

  • Professional repair workshops and rework labs


Achieve Professional Results with the XZZ SR17E Reballing Stencil

For technicians who value accuracy, durability, and consistency, the XZZ SR17E Laptop CPU IC Reballing Stencil is the ultimate choice. Its precision-engineered design ensures clean, uniform solder joints for reliable chip reinstallation and long-term device performance.

Whether you?re a professional in an electronics repair lab or a DIY enthusiast working on high-end laptop CPUs, the XZZ SR17E provides the precision and quality needed to deliver exceptional results?every single time.

Additional information

Weight 0.05 kg

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