Description
XZZ SR40B Stencil Laptop CPU IC Reballing Stencil
The XZZ SR40B Reballing Stencil is a premium-quality tool designed for laptop CPU, GPU, and IC reballing. Crafted with precision and made from high-grade stainless steel, this stencil provides unmatched accuracy and durability, making it an essential tool for electronics repair professionals, motherboard technicians, and hardware engineers who demand reliable, consistent performance.
Engineered for precision, the XZZ SR40B stencil allows seamless solder ball placement and reflow on delicate integrated circuit (IC) chips, helping you restore full functionality and prolong the lifespan of laptops and other electronic devices.
Professional-Grade Reballing Made Easy
Reballing is one of the most intricate processes in modern electronics repair. It involves replacing or reattaching solder balls to BGA (Ball Grid Array) chips, such as CPUs, GPUs, and RAM modules, to re-establish stable electrical connections.
The XZZ SR40B stencil simplifies this task by offering a perfect alignment system, ensuring every solder ball lands precisely where it should. With laser-cut micro-holes and uniform hole spacing, it enables even solder paste distribution and consistent solder ball formation during heating or reflow.
Its optimized hole layout ensures clean, professional results, even when working under a microscope, giving you factory-level precision in your repair projects.
High-Quality Stainless Steel Construction
Built to withstand the demands of professional use, the XZZ SR40B stencil is made from durable stainless steel, ensuring resistance to high heat, warping, and corrosion. This material not only offers a long service life but also maintains dimensional stability, even after repeated heating cycles.
Key construction features include:
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Laser-etched precision holes for superior accuracy
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Smooth anti-stick surface to prevent solder residue buildup
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High-temperature resistance for use with hot air and reflow stations
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0.12mm?0.15mm thin structure for excellent heat transfer and uniform reflow
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Corrosion and oxidation resistance for long-term reliability
This robust design ensures that the stencil remains flat and accurate, even after extensive use?perfect for demanding BGA rework environments.
Optimized for Laptop CPU and IC Rework
The XZZ SR40B stencil is specifically designed for laptop CPU and IC chip reballing, compatible with a wide range of chipsets from major manufacturers such as Intel, AMD, and NVIDIA.
It?s ideal for use in:
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Laptop motherboard repair and IC reattachment
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CPU and GPU reballing
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BGA chip replacement
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Professional micro-soldering workshops
The stencil?s layout and dimensions ensure precise alignment with modern laptop CPU and IC packages, making it a trusted tool in repair labs and technical workshops around the world.
Ease of Use for Efficient Rework
Using the XZZ SR40B stencil is straightforward and efficient. Simply align the stencil over the IC, apply solder paste or place pre-formed solder balls, and heat evenly using a reflow or hot air station. The stencil?s micro-holes allow for even solder distribution, ensuring that every solder ball melts and solidifies evenly?resulting in perfect solder joints and stable chip reinstallation.
The smooth surface finish also makes it easy to clean and reuse multiple times, maintaining consistent performance over many reballing sessions.
Why Choose the XZZ SR40B Reballing Stencil
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High-precision laser-cut holes for accurate solder alignment
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Made from premium stainless steel for superior durability
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Resistant to heat, warping, and oxidation
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Ideal for laptop CPU, GPU, and IC reballing
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Ultra-thin design (0.12?0.15mm) for efficient heat transfer
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Reusable, easy to clean, and long-lasting
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Compatible with professional rework stations
Applications
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Laptop CPU and GPU reballing
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Motherboard IC chip repair
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BGA chip replacement and micro-soldering
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Electronics repair training and workshops
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Rework stations and chip-level service centers
