Description
AMAOE IP11-012 STENCIL
AMAOE IP11-012 STENCIL For IPHONE 11 MIDDLE LAYER MOTHERBOARD REBALLING
Take your iPhone motherboard repairs to the next level with the AMAOE IP11-012 stencil for iPhone 11. Designed specifically for middle layer motherboard reballing, this high-precision stencil is the perfect tool for professional mobile technicians who demand accuracy, durability, and ease of use.
Crafted from premium-grade stainless steel, this AMAOE IP11-012 stencil for iPhone 11 ensures long-lasting performance even under high-temperature soldering conditions. Its laser-cut aperture design allows for flawless solder paste application and precise solder ball placement, which is critical in BGA chip rework and SMD soldering. Whether you’re replacing a damaged IC or restoring an entire motherboard layer, this stencil guarantees perfection every time.
Why choose the AMAOE IP11-012 stencil for iPhone 11? Because it’s engineered for accuracy, trusted by professionals, and delivers results that meet OEM-level standards. This stencil aligns perfectly with the iPhone 11 middle layer motherboard layout, reducing rework, saving time, and increasing repair success rates.
To use, simply align the stencil over the chip pads or PCB area, apply solder paste or place solder balls, and heat using a rework station. Its snug fit and stable design ensure the paste or balls are applied only where needed—no mess, no guesswork.
Backed by the trusted reputation of AMAOE, this stencil is your go-to solution for high-precision repairs. Whether you’re running a repair shop or handling advanced rework tasks, this tool delivers professional results with ease.
Upgrade your toolkit today with the AMAOE IP11-012 stencil for iPhone 11—a must-have for reliable, efficient, and clean reballing work. Quality you can trust, performance you can count on.
